ПЛАЗМЕННЫЕ ТЕХНОЛОГИИ
| Edição | Título | Arquivo | |
| Volume 52, Nº 5 (2023) | The Influence of Small F2, H2, and HF Additives on the Concentration of Active Particles in Tetrafluoromethane Plasma |
 (Rus) |
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| Efremov A., Smirnov S., Betelin V. | |||
| Volume 52, Nº 4 (2023) | Concentration of Fluorine Atoms and Kinetics of Reactive-Ion Etching of Silicon in CF4 + O2, CHF3 + O2, and C4F8 + O2 Mixtures |
(Rus) |
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| Efremov A., Bobylev A., Kwon K. | |||
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